发明名称 Semiconductor circuit assembly
摘要 The semiconductor circuit arrangement has one circuit substrate (12) which is enclosed by a housing (14) combined with a pressure structure (16) that applies the pressure to the circuit substrate that is arranged with the spring shaft (20) of the connecting elements (18). The pressure structure is formed with one ferrite core (34) and associated with the connection element. The connection element is formed with the through threads (28) of spring portion (26) connected with a pin (30) and a strap portion (32).
申请公布号 EP2466635(A2) 申请公布日期 2012.06.20
申请号 EP20110188735 申请日期 2011.11.11
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 HOFMAIR, MARKUS;MAUER, PETER
分类号 H01L23/049;H01L23/48 主分类号 H01L23/049
代理机构 代理人
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