发明名称 |
Semiconductor circuit assembly |
摘要 |
The semiconductor circuit arrangement has one circuit substrate (12) which is enclosed by a housing (14) combined with a pressure structure (16) that applies the pressure to the circuit substrate that is arranged with the spring shaft (20) of the connecting elements (18). The pressure structure is formed with one ferrite core (34) and associated with the connection element. The connection element is formed with the through threads (28) of spring portion (26) connected with a pin (30) and a strap portion (32). |
申请公布号 |
EP2466635(A2) |
申请公布日期 |
2012.06.20 |
申请号 |
EP20110188735 |
申请日期 |
2011.11.11 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
HOFMAIR, MARKUS;MAUER, PETER |
分类号 |
H01L23/049;H01L23/48 |
主分类号 |
H01L23/049 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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