发明名称 LASER MACHINING DEVICE AND LASER MACHINING METHOD
摘要 <p>The controllability of modified spots is improved. A laser processing apparatus 100 comprises a first laser light source 101 for emitting a first pulsed laser light L1, a second laser light source 102 for emitting a second pulsed laser light L2, half-wave plates 104, 105 for respectively changing directions of polarization of the pulsed laser light L1, L2, polarization beam splitters 106, 107 for respectively polarization-separating the pulsed laser light L1, L2 having changed the directions of polarization, and a condenser lens 112 for converging the polarization-separated pulsed laser light L1, L2 at an object to be processed 1. When the directions of polarization of the pulsed laser light L1, L2 changed by the half-wave plates 104, 105 are varied by a light intensity controller 121 in the laser processing apparatus 100, the ratios of the pulsed laser light L1, L2 polarization-separated by the polarization beam splitters 106, 107 are altered, whereby the respective intensities of the pulsed laser light L1, L2 are adjusted.</p>
申请公布号 EP2465634(A1) 申请公布日期 2012.06.20
申请号 EP20100808172 申请日期 2010.08.06
申请人 HAMAMATSU PHOTONICS K.K. 发明人 FUKUMITSU KENSHI
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/38;B23K26/40;B28D5/00;C03B33/09 主分类号 B23K26/00
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