Integral transceiver in millimetric waves

摘要

The transceiver has an interposer plate (3) i.e. silicon plate, whose upper face bears a network of interconnections and lower face mounted on an electronic device. An integrated circuit chip (1) is mounted on the upper face of the plate. An antenna (30) includes a track formed on the upper face of the plate. A block (32) is fixed under the plate, and includes a recess (34) next to the antenna. A bottom part of the recess is metalized. Distance between the antenna and the bottom part is in the order of one-fourth value of wavelength by considering dielectric constants of interposed materials.