发明名称 Nonvolatile memory devices having a three dimensional structure
摘要 Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device may include cell arrays having a plurality of conductive patterns having a line shape three dimensionally arranged on a semiconductor substrate, the cell arrays being separated from one another; semiconductor patterns extending from the semiconductor substrate to cross sidewalls of the conductive patterns; common source regions provided in the semiconductor substrate under a lower portion of the semiconductor patterns in a direction in which the conductive patterns extend; a first impurity region provided in the semiconductor substrate so that the first impurity region extends in a direction crossing the conductive patterns to electrically connect the common source regions; and a first contact hole exposing a portion of the first impurity region between the separated cell arrays.
申请公布号 US8203211(B2) 申请公布日期 2012.06.19
申请号 US20100798525 申请日期 2010.04.06
申请人 JEONG JAEHUN;KIM HANSOO;JANG JAEHOON;CHO HOOSUNG;KIM KYOUNG-HOON;SAMSUNG ELECTRONICS CO., LTD. 发明人 JEONG JAEHUN;KIM HANSOO;JANG JAEHOON;CHO HOOSUNG;KIM KYOUNG-HOON
分类号 H01L27/115;H01L23/522 主分类号 H01L27/115
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