发明名称 Improvements for reducing electromigration effect in an integrated circuit
摘要 An integrated circuit comprising one or more dielectric layers the or each dielectric layer being provided with one or more interconnects wherein the interconnect comprises metallic atoms moving from a first region of the interconnect to a second region of the interconnect when a current flows, characterized in that the interconnect comprises a donor zone in the first region of the interconnect for providing metallic atoms in order to compensate for movement of atoms from the first region and a receptor zone at the second region of the interconnect for receiving metallic atoms in order to compensate for movement of atoms to the second region.
申请公布号 US8202798(B2) 申请公布日期 2012.06.19
申请号 US20100675242 申请日期 2010.02.25
申请人 BRAECKELMANN GREG;KAWASAKI HISAO;ORLOWSKI MARIUS;PETITPREZ EMMANUEL;FREESCALE SEMICONDUCTOR, INC. 发明人 BRAECKELMANN GREG;KAWASAKI HISAO;ORLOWSKI MARIUS;PETITPREZ EMMANUEL
分类号 H01L21/4763 主分类号 H01L21/4763
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