| 摘要 |
A hollow part (36) such as a through-hole is formed in a silicon substrate (32) so as to pass through the front and the back thereof. A vibration electrode plate (34) is arranged on an upper surface of the silicon substrate (32) to cover the opening on the upper surface side of the hollow part (36). A fixed electrode plate (35) covers the upper side of the vibration electrode plate (34) while maintaining a microscopic gap with the vibration electrode plate (34), where the peripheral part is fixed to the upper surface of the silicon substrate (32). The fixed electrode plate (35) has the portion facing the upper surface of the silicon substrate (32) through a space supported by a side wall portions arranged on an inner edge of the portion fixed to the upper surface of the silicon substrate (32) without interposing a space, and the outer surface of the side wall portion of the fixed electrode plate (35) is covered by a reinforcement film (44) made of metal such as Au, Cr, and Pt. |
