发明名称 |
Method of manufacturing electronic component embedded circuit board |
摘要 |
An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
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申请公布号 |
US8201324(B2) |
申请公布日期 |
2012.06.19 |
申请号 |
US20090359416 |
申请日期 |
2009.01.26 |
申请人 |
KIM BYOUNG-CHAN;SHIN YOUNG-HWAN;LEE JONG-JIN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM BYOUNG-CHAN;SHIN YOUNG-HWAN;LEE JONG-JIN |
分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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