发明名称 Method of manufacturing semiconductor devices and semiconductor manufacturing apparatus
摘要 In a method of manufacturing a semiconductor device with plasma generated in a process chamber by impressing radio-frequency power, a level of a radio-frequency power for each step is switched over in response to processing in each step upon applying a plurality of processing steps to a semiconductor substrate while holding the semiconductor substrate, and thereby the plurality of steps are carried out successively.
申请公布号 US8202394(B2) 申请公布日期 2012.06.19
申请号 US20020166303 申请日期 2002.06.11
申请人 MORIYA TSUYOSHI;ITO NATSUKO;UESUGI FUMIHIKO;RENESAS ELECTRONICS CORPORATION 发明人 MORIYA TSUYOSHI;ITO NATSUKO;UESUGI FUMIHIKO
分类号 H01L21/3065;H01L21/302;H01L21/311;H01L21/3213;H01L21/461 主分类号 H01L21/3065
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