LEAD FLAME SUBSTRATE FOR LED PACKAGE AND METHOD OF MANUFACTURING OF THE SAME

摘要

PURPOSE: A lead frame substrate for an LED package and a manufacturing method thereof are provided to reduce manufacturing costs by using an etching method and an anodizing method which uses an aluminum substrate. CONSTITUTION: A cavity(104) for forming an electrode is formed at the lower side of a metallic board. An aluminum oxide layer is formed inside the cavity by an anodizing process. The upper side of the metallic board is etched in order to expose the cavity. A plating layer(108) is formed on the surface of the metallic board. An LED chip is mounted on the plating layer. The LED chip and a circuit pattern are bonded by using a wire. The upper side of the LED chip and the circuit pattern is molded by a fluorescent substance and a resin.