SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce a load between different kinds of materials by minimizing an area ratio of a conductive material filling a through via. CONSTITUTION: A second redistribution layer(160) is electrically connected to one end of a via set(120). A semiconductor chip(210) is electrically connected to a first redistribution layer(150). A molding layer(250) is formed on a first dielectric layer(130) and the first redistribution layer. A molding layer covers up the semiconductor chip. A bump is connected to the second redistribution layer.