| 摘要 |
The present disclosure provides a semiconductor device and method of fabricating a semiconductor device. In an embodiment, the semiconductor device is a finFET device. In an embodiment, the semiconductor device is a silicon on insulator (SOI) device. A method of fabricating the semiconductor device includes providing a substrate, forming an oxide layer on the substrate, forming a fin on a portion of the oxide layer, forming a high k dielectric layer on a portion of the oxide layer and on a portion of the fin, forming a tuned, stressed metal gate on the dielectric layer, and forming a poly-cap on the metal gate. The method of fabrication provided may allow use of SOI substrate or bulk silicon substrates. |
