| 摘要 |
PURPOSE: A polyimide based resin composition is provided to improve polyimide layer contacting to an adhesive layer by comprising an adhesion-increasing additive with specific structure. CONSTITUTION: At least one or more polyimide layers contacting to a metal lamination comprises an adhesion-increasing additive which is represented by chemical formula 1: XnYmZl or chemical formula 2: AiBjCk. In the chemical formula 1, X comprises Be, Mg, Ca, Sr, Ba, and Ra as atoms of family II, Y and Z are same or different fromeach other, n is a natural number from 1-3, and m and l are natural numbers from 0-3. In the chemical formula 2, A comprises Be, Mg, Ca, Sr, Ba, and Ra as atoms of family II, L and M comprise S2O3, SO4, OH, H, CO3, Cl, O, C, NO3, I, MnO4, PO4, CrO4, IO3, (CH3)3CO, Br, NCN, H2PO4, F,C2O4, and ClO4, B and C are same or different from each other, and i is a natural number of 1 or more, j and k are respectively a natural number of 0 or more, and j+k is a natural number of 2 or more.
|
