| 摘要 |
A vacuum processing apparatus includes a first lock chamber and a second lock chamber coupled to a back face side of the atmospheric transfer chamber in parallel, a first transfer chamber coupled to a rear side of the first lock chamber, a second transfer chamber coupled, on the rear side of the first transfer chamber, a third transfer chamber coupled to the rear side of the second lock chamber, a first and a second relay chamber disposed between the first transfer chamber/the second transfer chamber and the first transfer chamber/the third transfer chamber to transfer a wafer between these chambers, and a plurality of processing chambers coupled to either the first, the second or the third transfer chamber, in addition, the number of the processing chambers coupled to the second transfer chamber is greater than that of the processing chambers coupled to either the first or the third transfer chamber, and the wafer alone processed in the processing chamber coupled to either the first or the second transfer chamber is transferred to the third robot in the second relay chamber. |
