| 摘要 |
PURPOSE: A light emitting diode package assembly and a manufacturing method thereof are provided to simplify a manufacturing process by combining a lead frame with a connection unit of a circuit board at a high temperature state. CONSTITUTION: A circuit board(30) includes a connection unit(34) and a wiring layer(32). The connection unit is formed on an inner surface of a groove portion(36). The wiring layer is connected to the connection unit. A lead frame(20) is electrically connected to an LED chip(10). A part of the lead frame is inserted into the groove portion to be connected to the connection unit.
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