SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to have decreased thickness by not using a substrate. CONSTITUTION: A mold portion(200) surrounds an upper side and a lateral side of a semiconductor chip module. A metal electrode(300) is formed on one side of the mold portion. A connecting member(400) electrically connects the semiconductor chip module and the metal electrode. A first insulating layer pattern(500) is formed on a lower surface of the semiconductor chip module and one side of the mold portion. The first insulating layer pattern has an opening portion exposing the metal electrode.