| 摘要 |
The invention discloses a manufacturing method of multilayered board. The method includes the steps of arranging an upper heat source and a lower heat source; arranging buffer cushions between the heat sources; stacking a plurality of PCBs among the buffer cushions; stacking copper foils for packaging the PCBs; and pressing the above upper heat source and the lower heat source, thereby minimizing temperature differences between the sources and a corresponding plurality of stacking boards. |
