| 摘要 |
The invention relates to a method and a device for the testing of noncomponented circuit boards. The method according to the invention is used to determine deviations of circuit board test points of a series of circuit boards from the CAD data relating to these circuit boards, by scanning the surface of the circuit board by an imaging method and subjecting this image to automatic image analysis so that it may be compared with the CAD data. The CAD data are then suitably corrected so that, with the aid of the corrected CAD data, the circuit board may be tested in a finger tester, with test fingers of the finger tester being controlled on the basis of the deviations found. |
