发明名称 PRINTED CIRCUIT BOARD AND SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING AND SUBSTRATE FOR PRINTED CIRCUIT BOARD
摘要 PURPOSE: A printed circuit board, a substrate material using the same, and a method for manufacturing thereof are provided to improve hole workability of the substrate material by improving laser absorbing rate of glass fiber. CONSTITUTION: Glass fiber(111) is impregnated in a resin layer(113). The glass fiber comprises fiber and absorbing material including glass. The glass fiber increases the intensity of a printed circuit board in regard to a bending phenomenon. The absorbing material absorbs laser. The absorbing material is coated in the glass fiber. The absorbing material includes one among triazene, arbodiimide, and ester or carbonate. A substrate material comprises the absorbing material. A circuit pattern is formed on the surface of the substrate material.
申请公布号 KR20120063936(A) 申请公布日期 2012.06.18
申请号 KR20100125119 申请日期 2010.12.08
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, YEON DONG;LEE, YONG SAM;CHANG, TAE EUN;KIM, KI HWAN;YOO, KI YOUNG
分类号 H05K3/40;H05K1/03 主分类号 H05K3/40
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