发明名称 |
PRINTED CIRCUIT BOARD AND SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING AND SUBSTRATE FOR PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE: A printed circuit board, a substrate material using the same, and a method for manufacturing thereof are provided to improve hole workability of the substrate material by improving laser absorbing rate of glass fiber. CONSTITUTION: Glass fiber(111) is impregnated in a resin layer(113). The glass fiber comprises fiber and absorbing material including glass. The glass fiber increases the intensity of a printed circuit board in regard to a bending phenomenon. The absorbing material absorbs laser. The absorbing material is coated in the glass fiber. The absorbing material includes one among triazene, arbodiimide, and ester or carbonate. A substrate material comprises the absorbing material. A circuit pattern is formed on the surface of the substrate material. |
申请公布号 |
KR20120063936(A) |
申请公布日期 |
2012.06.18 |
申请号 |
KR20100125119 |
申请日期 |
2010.12.08 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI, YEON DONG;LEE, YONG SAM;CHANG, TAE EUN;KIM, KI HWAN;YOO, KI YOUNG |
分类号 |
H05K3/40;H05K1/03 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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