| 摘要 |
PURPOSE: A blanket integrated heat radiation circuit board and a chassis structure including the same are provided to improve a heat radiation property by directly transmitting heat from the heat radiation circuit board to the chassis. CONSTITUTION: A heat radiation circuit board includes a support board(130), an insulation layer(140), a circuit pattern, and a solder resist. The support board includes a first region and a second region which are bent. The insulation layer is formed on the support board. A circuit pattern or pad is formed on the insulation layer. The solder resist exposes the pad. An adhesion layer(120) is formed on the lower side of the support board to be adhered to a chassis. |
