OPTICAL PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: An optical package and a manufacturing method thereof are provided to improve optical characteristics by minimizing tolerance of a solder resist which is printed on the partition wall of a functionality hole. CONSTITUTION: A functionality hole area(120) is formed at an insulation film(110). A metal layer is laminated at the lower side of the insulation film. A solder resist(140) is printed on the upper side of the insulation film. A circuit pattern(131) is formed on the rear side of the insulation film in which the solder resist is printed. A optical device(150) is mounted in a chip mounting area. The chip mounting area is electrically connected with a wire bonding area. A resin unit(170) reclaims the chip mounting area including the resin unit. The resin unit is formed into a convex lens shape and comprises a transparent resin and luminescent material.