摘要 |
PURPOSE: A light source module is provided to improve thermal stability of an encapsulation part which is comprised of a transparent resin by separately forming the encapsulation part from a light emitting chip. CONSTITUTION: A light emitting array is comprised of a plurality of light emitting chips(112) mounted on a circuit board. An encapsulation part(118) is formed by being separated from the light emitting chip along the major axis direction of the circuit board. The encapsulation part includes a storage space for accepting the light emitting chips. A reflector(122) is formed between the circuit board and the encapsulation part along the minor axis direction of the circuit board in order to seal the storage space. A reflecting layer is formed between the circuit board and the encapsulation part along the major axis direction of the circuit board.
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