| 摘要 |
PURPOSE: A semiconductor package and a method for selecting a chip of the semiconductor package are provided to remove a rearrangement wiring and a bonding wire by selecting the chip with a mechanical switching method using a cantilever. CONSTITUTION: A first semiconductor chip(100) includes a first through electrode(102). A second semiconductor chip(200) is laminated on the upper side of the first semiconductor chip. The second semiconductor chip includes a second through electrode(202). A cantilever(120) is formed on the upper side of the first semiconductor chip. The cantilever is electrically connected to the first through electrode or the second through electrode according to an electric signal. |
