WAFER AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A wafer and a manufacturing method thereof are provided to prevent damage of the front surface of a silicon wafer by performing a polishing process after growing a seal layer on the front surface of the wafer. CONSTITUTION: Seal layers(30a,30b) are grown on a first side of a wafer(20). The seal layer is grown on a second side facing to the first side. The seal layer is eliminated by processing the seal layer on the first side with hydrofluoric acid(HF). The first side of the wafer in which the seal layer is eliminated is polished.