| 摘要 |
PURPOSE: An LED package and a manufacturing method thereof are provided to improve thermal conductivity by directly mounting an LED chip on the metal substrate. CONSTITUTION: A first electrode(231) is adhered to a metal substrate(300). A second electrode(232) is separated from the first electrode on the metal substrate. The second electrode includes a penetration hole(600) which is larger than the size of the LED chip. The LED chip is directly mounted on the metal substrate. The LED chip is connected to the first electrode and the second electrode. |
