SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME

摘要

PURPOSE: A semiconductor package and a display panel assembly including the same are provided to protect a circuit from external impacts, moisture, and chemical materials by forming a protection layer which covers a wiring circuit in an opposite direction to a semiconductor chip around a film. CONSTITUTION: A semiconductor chip(100) is received in a hole between films(300). A passivation layer(750) protects a semiconductor chip from the outside. A metal pad(800) electrically connects the semiconductor chip to the substrate. A molding member(200) covers the semiconductor chip, the metal pad, and the passivation layer. A protection layer(700) is opposite to the semiconductor chip around the film.