发明名称 |
CLAMPOF PLASMA CLEANING DEVICE |
摘要 |
PURPOSE: A clamp of a plasma cleaning apparatus is provided to prevent damage of a solder ball and burning damage by minimizing a space of a lower part and the solder ball of the lower surface of a printed circuit board. CONSTITUTION: A plurality of mounting grooves(111) is formed on the center region of the upper surface of a bottom plate. A guide groove(112) is respectively formed on both side regions of the upper surface of the bottom plate by being separated by the mounting grooves. A compression spring is vertically installed on the guide groove. A pressurizing unit(130) is combined in order to be penetrated by the compression spring on the guide groove. Both ends of a printed circuit board are clamped by the pressurizing unit. The printed circuit board is horizontally maintained by pressing the upper part of the pressurizing unit.
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申请公布号 |
KR20120062985(A) |
申请公布日期 |
2012.06.15 |
申请号 |
KR20100123950 |
申请日期 |
2010.12.07 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
KIM, KWANG HO;KIM, JIN SEONG;PARK, DONG JOO |
分类号 |
H01L21/50;H01L21/3065;H01L21/687 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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