发明名称 HEAT PUMP DEVICE
摘要 Provided is a heat pump device which uses a secondary loop cooling cycle to enable implementation of cooling and heating simultaneously while ensuring reliability and efficiency and while heating a second heating medium to a high temperature with high efficiency. With the heat pump device (100) a heating medium converter (3) and a water temperature heater (300) each are provided with two connection ports (connection port (51a), connection port (51b), connection port (305a), connection port (305b)) capable of connecting cooling medium pipes (311). A cooling medium circulation circuit (A) and a cooling medium circulation circuit (C) are connected via a heat exchanger (304) mounted in the water temperature heater (300), and a second heating medium is heated with a first heat exchanger (302).
申请公布号 WO2012077156(A1) 申请公布日期 2012.06.14
申请号 WO2010JP07097 申请日期 2010.12.07
申请人 MITSUBISHI ELECTRIC CORPORATION;MORIMOTO, HIROYUKI;YAMASHITA, KOJI 发明人 MORIMOTO, HIROYUKI;YAMASHITA, KOJI
分类号 F25B1/00 主分类号 F25B1/00
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