| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of reducing the cost in mounting the semiconductor chip, capable of downsizing a package substrate, and capable of optimizing a wiring pattern. <P>SOLUTION: A semiconductor chip 10 comprises: an electrode pad group 1 that is provided in the semiconductor chip 10 and has at least one of electrode pads 6; and an electrode pad group 2 that has at least one of electrode pads 7 provided in the semiconductor chip 10 and capable of outputting the same signals as the signals output from the electrode pads 6. In one electrode pad in the first electrode pad group and one electrode pad in the second electrode pad group, one of the electrode pads near the other electrode pad, to which the signal is applied, of the other semiconductor chip is connected to the other electrode pad of the other semiconductor chip. <P>COPYRIGHT: (C)2012,JPO&INPIT |
