| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a gold plating solution and a plating method that can hold properties of a gold film on the surface of an electronic component such as a connector and can deposit a gold plating film in a desired part while restricting deposition in an undesired part. <P>SOLUTION: The gold plating solution and the plating method are provided using a gold plating solution containing: gold cyanide or salt thereof serving as a gold source; a cobalt compound; and a product obtained by reacting at least a nitrogen-containing heterocyclic compound with epihalohydrin. The gold plating solution thereby has high deposition selectivity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
