发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board having a high manufacturing yield and excellent electric characteristics, and a method for manufacturing the same. <P>SOLUTION: The wiring board comprises a rigid main board having a conductor pattern on at least in one side and an opening; a flex-rigid printed wiring board in which at least a rigid part and a flexible part are connected to each other, the main board and the rigid part are arranged in the opening so as to adjoin each other, and the conductor pattern is formed on at least one of the rigid part and the flexible part; and an insulating layer formed across the rigid part and the main substrate, and not formed on the flexible part. The conductor pattern of the main board and the conductor pattern of the flex-rigid printed wiring board are electrically connected to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012114482(A) 申请公布日期 2012.06.14
申请号 JP20120066428 申请日期 2012.03.22
申请人 IBIDEN CO LTD 发明人 TAKAHASHI MICHIMASA
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址