THERMOSETTING RESIN COMPOSITION AND PREPREG SHEET OR LAMINATED BOARD USING THE THERMOSETTING RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition with low dielectric constant and a low dielectric loss tangent and halogen-free; and to provide a prepreg sheet or a laminate using the thermosetting epoxy resin composition.

SOLUTION: This thermosetting resin composition includes an epoxy resin and a curing agent. The curing agent is a mixed curing agent by blending phenolphthalein benzoxazine phenol or a styrene-maleic anhydride copolymer to a multifunctional aromatic polyester curing agent. The prepreg sheet can be formed by impregnating an organic or inorganic woven or nonwoven fiber reinforcing material with the thermosetting resin composition. Also the laminated board can be formed by joining a metal foil to the prepreg sheet.

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