| 摘要 |
The invention relates to an improved encapsulation for a printed circuit board that is populated with electronic components, especially for a printed circuit board having electronic components that have to meet certain safety standards because they are used, e.g. in the area of explosion control. The printed circuit board assembly is coated with a bottom layer, preferably a bottom layer produced from a plasma and pretreated such that the protective coat adheres on the entire surface of the printed circuit board assembly evenly and in a sufficient thickness and does not shrink during the subsequent curing process regardless of the material of the surface and/or regardless of the fact whether the coat is applied to a geometrically problematic area on the printed circuit board assembly such as a corner or an edge. |
