FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRODUCING STRIP FILM FOR SEMICONDUCTOR BACK SURFACE, AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor rear surface film, a manufacturing method thereof, and a flip chip type semiconductor device are provided to process a separator using silicon based remover, thereby easily delaminating the separator from the semiconductor rear surface film. CONSTITUTION: A flip chip type semiconductor rear surface film(2) is formed on the rear side of a semiconductor device. A result of dividing elongation ratio with tensile storage modulus of the flip chip type semiconductor rear surface film at 23°C is in a range of 1 to 8×103 percent/GPa. The tensile storage modulus is in a range of 0.01 to 4.0 GPa.