| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method which can enhance the mounting accuracy of a component by making situations substantially the same, where imaging means is heated by a substrate heater when the component is aligned before being mounted and when the component is mounted. <P>SOLUTION: When a device error is detected by imaging a jig component JG mounted on a jig component mounting part AR2 from above by an imaging camera 16 and acquiring a first captured image, and by imaging the jig component JG picked up by a mounting head 15 from below by the imaging camera 16 and acquiring a second captured image, the jig component mounting part AR2 is selected so that the situation where the imaging camera 16 is heated by a substrate heater H2 is close to the situation where the imaging camera 16 is heated subsequently by the substrate heater H2 when a component 3 and a component mounting part 2a are aligned. <P>COPYRIGHT: (C)2012,JPO&INPIT |
