发明名称 |
COPPER FOIL, AND METHOD FOR PRODUCING COPPER FOIL |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper foil capable of providing improved folding endurance and adhesiveness, and a method for producing copper foil. <P>SOLUTION: Copper foil 1 has a roughened layer 20 formed on at least one surface of a copper foil material 10 and one or more rust prevention layers 30 formed on the roughened layer 20. The roughened layer 20 is formed on the surface of the copper foil material 10 after subjected to chemical polishing without applying an undercoat layer. The average depth of a recess 11 formed on the surface of the copper foil material 10 after subjected to chemical polishing is 0.05 μm or more and 0.3 μm or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012112009(A) |
申请公布日期 |
2012.06.14 |
申请号 |
JP20100263195 |
申请日期 |
2010.11.26 |
申请人 |
HITACHI CABLE LTD |
发明人 |
GOTO CHIZURU;TAGA KATSUTOSHI |
分类号 |
C25D7/06;C23F3/06;C25D5/34;H05K1/09 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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