| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board and a method for manufacturing the same, capable of accurately recognizing recognition marks by an image recognition device to accurately connect electrodes of a semiconductor element and semiconductor element connecting pads via solders. <P>SOLUTION: A wiring board comprises on an upper surface of an insulating board 1 on which a semiconductor element S is to be mounted: semiconductor element connecting pads 3 to which electrodes T of the semiconductor element S are to be connected via solders 7; and recognition marks 5 as a positioning reference for mounting the semiconductor element S. The solders 7 and solders 8 are welded to surfaces of the semiconductor element connecting pads 3 and the recognition marks 5. The semiconductor element connecting pads 3 and the recognition marks 5 each are formed in a circular pattern having the same size, and the solders 7 and 8 having the same size are welded thereto. Top surfaces of the solders 7 and 8 welded to the semiconductor element connecting pads 3 and the recognition marks 5 are flattened by a press. <P>COPYRIGHT: (C)2012,JPO&INPIT |
