| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having low warping property, excellent heat resistance reliability and wire sweep property, and to provide a sealed semiconductor device sealed using the same. <P>SOLUTION: The epoxy resin composition contains an epoxy resin, a curing agent, a coupling curing accelerator, and an inorganic filler as essential components. The epoxy resin composition is characterized in that the epoxy resin having the specific structure, the curing agent and a coupling agent are compounded. <P>COPYRIGHT: (C)2012,JPO&INPIT |
