发明名称 |
SOCKET AND SEMICONDUCTOR DEVICE PROVIDED WITH SOCKET |
摘要 |
There is provided a socket. The socket includes: a wiring substrate including a first surface and a second surface opposite to the first surface; a plurality of connection terminals provided on the wiring substrate and each including a contact portion, wherein the connection terminals extend from the first surface of the wiring substrate; and a positioning member formed in a frame shape and provided on the wiring substrate to surround the connection terminals. The positioning member includes a sidewall plate having a plurality of holes formed therethrough.
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申请公布号 |
US2012149249(A1) |
申请公布日期 |
2012.06.14 |
申请号 |
US201113313563 |
申请日期 |
2011.12.07 |
申请人 |
IHARA YOSHIHIRO;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
IHARA YOSHIHIRO |
分类号 |
H01R24/28;H01L23/48 |
主分类号 |
H01R24/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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