发明名称 |
CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING |
摘要 |
A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate. |
申请公布号 |
US2012149287(A1) |
申请公布日期 |
2012.06.14 |
申请号 |
US201113324146 |
申请日期 |
2011.12.13 |
申请人 |
WU JIANHUI;SCHULZ ERIC M.;RAMANATH SRINIVASAN;KHAUND ARUP K.;SAINT-GOBAIN ABRASIFS;SAINT-GOBAIN ABRASIVES, INC. |
发明人 |
WU JIANHUI;SCHULZ ERIC M.;RAMANATH SRINIVASAN;KHAUND ARUP K. |
分类号 |
B24B53/017;B24D3/06;B24D18/00 |
主分类号 |
B24B53/017 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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