发明名称 |
MULTILAYER PRINTED WIRING BOARDS WITH HOLES REQUIRING COPPER WRAP PLATE |
摘要 |
Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries. |
申请公布号 |
US2012144667(A1) |
申请公布日期 |
2012.06.14 |
申请号 |
US201213399995 |
申请日期 |
2012.02.17 |
申请人 |
SIDHU RAJWANT SINGH;DDI GLOBAL CORP. |
发明人 |
SIDHU RAJWANT SINGH |
分类号 |
H05K3/10 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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