发明名称 LIGHT EMITTING CHIP AND METHOD FOR MANUFACTURING THE SAME
摘要 A light emitting chip includes a substrate, a heat conducting layer formed on the substrate, a light emitting structure and a connecting layer connecting the heat conducting layer with the light emitting structure. The heat conducting layer includes a plurality of spaced catalyst areas on the substrate and a plurality of carbon nanotube islands vertically grown from the catalyst areas. The light emitting structure includes a first semiconductor layer, a light emitting layer and a second semiconductor layer. A first transparent conductive layer and a current conducting layer are sandwiched between the first semiconductor layer and the connecting layer. A second transparent conductive layer is formed on the second semiconductor layer.
申请公布号 US2012146071(A1) 申请公布日期 2012.06.14
申请号 US201113015550 申请日期 2011.01.27
申请人 TSANG JIAN-SHIHN;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 TSANG JIAN-SHIHN
分类号 H01L33/64;H01L21/36 主分类号 H01L33/64
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