| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component reduced in size and height and capable of being manufactured at low cost, while securing desired filter performance. <P>SOLUTION: An electronic component 100 comprises: a substrate 11 composed of a magnetic ceramic material; a thin-film element layer 12 including a coil conductor formed on one principal surface of the substrate 11; thick bump electrodes 13a to 13d formed on a principal surface of the thin-film element layer 12 by plating; and an insulating layer 14 formed on the principal surface of the thin-film element layer 12 except formation positions of the bump electrodes 13a to 13d. The bump electrodes 13a to 13d each have a first exposed surface exposed on a principal surface of the insulating layer 14, and a second exposed surface exposed on an end surface of the insulating layer 14. The area of each first exposed surface of the first and third bump electrodes 13a and 13c is greater than that of each first exposed surface of the second and fourth bump electrodes 13b and 13d. <P>COPYRIGHT: (C)2012,JPO&INPIT |
