| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive tape cutting method which allows for enhancement of the cutting accuracy of a supporting adhesive tape that adhesion holds the semiconductor wafer of a ring frame. <P>SOLUTION: In a state where the reference surface 62 on the distal end side of a cutter holder 43 holding a cutter blade 42 is in contact with the surface of the base material (b) of a supporting adhesive tape DT, the supporting adhesive tape DT is cut while making the reference surface of the cutter holder 43 follow up the surface of the base material. At this time, the tip of the cutter blade 42 is made to pass through the verge of the adhesion interface to a ring frame (f) without penetrating an adhesive layer (a). <P>COPYRIGHT: (C)2012,JPO&INPIT |
