| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a speaker mounting structure which decreases thickness, and can certainly and finely emit sound generated in a speaker to the outside of a case, with a simple structure. <P>SOLUTION: On a contact sheet 13 disposed on a circuit substrate 10 provided in an upper case 8, a speaker fitting part 17 opened to upper and lower sides of the circuit substrate 10 and to which a speaker 16 is fitted by press-fitting is integrally formed. Therefore, only by press-fitting the speaker 16 into the speaker fitting part 17 of the contact sheet 13, the speaker 16 can be simply installed so as not to leak the sound of the speaker 16. A structure of a speaker part 6 is simple, and has a small number of components, and the thickness of the speaker part 6 can be decreased. When the speaker 16 produces sound, the generation of chattering sound is prevented, and the sound of the speaker 16 can be certainly and finely emitted from the speaker fitting part 17 to the outside of the upper case 8. <P>COPYRIGHT: (C)2012,JPO&INPIT |
