| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a repair analysis apparatus and method thereof for calculating a repair solution by utilizing information on a defective cell discovered inside a memory. <P>SOLUTION: A repair analysis apparatus includes a selector 610 and an analyzer 620. In response to a control code, the selector 610 selects a part of row addresses of a plurality of spare pivot defective cells and a part of column addresses. The analyzer 620 generates analysis signals representing whether row addresses of a plurality of non-spare pivot defective cells are included in the row addresses selected by the selector 610 and whether column addresses of the plurality of non-spare pivot defective cells are included in the column addresses selected by the selector 610. <P>COPYRIGHT: (C)2012,JPO&INPIT |
