SUBSTRATE PROCESSING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide substrate processing equipment capable of preventing an end portion of a heating element from reducing its lifetime due to a pest phenomenon.

SOLUTION: Substrate processing equipment comprises: a processing chamber for processing a wafer 105; a heating device for heating the wafer 105 in the processing chamber. The heating device includes: a heat insulating body 107 covering the processing chamber; a heating element 108 provided in an inner periphery surface of the heat insulating body 107 and composed of molybdenum disilicide; a cover 84 surrounding an end portion of the heating element 108 pulled out of the heat insulating body 107; and an inert gas supply device 87 for supplying an inert gas into the cover 84. The heat insulating body 107 has an inert gas supply line 122 for supplying the inert gas connected thereto. Supplying the inert gas into the cover can prevent the end portion of the heating element from reducing its lifetime due to a pest phenomenon in a low temperature region.

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