METHOD OF PREPARING METAL SUBSTRATE FOR ELECTRONIC DEVICE AND PACKAGE OF THE SAME

摘要

PURPOSE: A method for manufacturing a metal board for mounting an electronic device and a method for manufacturing an electronic device package are provided to increase a lifetime of an electronic device by discharging heat from the electronic device. CONSTITUTION: A first hole(111h) which passes through a metal plate(110) is formed. The inside of the first hole is anodized. An insulation unit is formed in the first hole. A second hole which passes through the insulation unit is formed. An electrode unit is formed to supply power to an electronic device.