发明名称 HEAT MEDIUM HEATING DEVICE
摘要 <p>The purpose of the present invention is to provide a heat medium heating device which is capable of improving adhesion between a PTC element and an electrode plate, and furthermore adhesion between a PTC heater and a heat medium channel-forming member, while suppressing increase in the cost. A heat medium heating device (10) is provided with: an inner pipe main body (21), on the inside of which a channel for a heat medium is formed; an outer pipe main body (31), which is arranged on the outer circumferential side of the inner pipe main body (21), and on the outside of which a channel for the heat medium is formed; and a PTC heater (40) that is sandwiched and held between the inner pipe main body (21) and the outer pipe main body (31). The outer shapes of the inner pipe main body (21) and the outer pipe main body (31) may be circular or may be rectangular. In addition, it is preferable that the inner pipe main body (21) and the outer pipe main body (31) are respectively provided with fins (24, 34) that face the channels of the heat medium.</p>
申请公布号 WO2012077266(A1) 申请公布日期 2012.06.14
申请号 WO2011JP05341 申请日期 2011.09.22
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD.;WATANABE, YASUNORI;CHUMAN, YASUHARU;KUGA, KAZUNORI;KOMINAMI, SATOSI 发明人 WATANABE, YASUNORI;CHUMAN, YASUHARU;KUGA, KAZUNORI;KOMINAMI, SATOSI
分类号 B60H1/22;H01C7/02 主分类号 B60H1/22
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