| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING TEMPERATURE THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package mounted on a package substrate. <P>SOLUTION: The semiconductor package according to one embodiment of the present invention comprises a temperature measurement device and a temperature control circuit. The temperature measurement device has a function to measure a temperature of the semiconductor package. The temperature control circuit has a function to change an operation speed of the semiconductor package with reference to the temperature of the semiconductor package measured by the temperature measurement device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012114446(A) |
申请公布日期 |
2012.06.14 |
| 申请号 |
JP20110257509 |
申请日期 |
2011.11.25 |
| 申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KIM JAE-CHUN;CHO EUN-SEOK;CHOI MI-NA;CHOI KYOUNG-SEI;HWANG HEEJUNG;BAE SERAN |
| 分类号 |
H01L23/34;G11C5/00 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
