发明名称 MOTHERBOARD SYSTEM HAVING HEAT DISSIPATING DEVICE
摘要 A motherboard system includes a PCB, a CPU socket mounted on the PCB, a heat dissipating device, and a number of fastening devices. The CPU socket is configured for receiving a CPU. The heat dissipating device is mounted on the CPU socket for dissipating heat generated by the CPU. The fastening devices extend through the heat dissipating device and the CPU socket and are engaged in the PCB, thereby fastening the heat dissipating device, and the CPU socket to the PCB.
申请公布号 US2012147554(A1) 申请公布日期 2012.06.14
申请号 US20100982906 申请日期 2010.12.31
申请人 LI JI-CHAO;DENG BO;CAO XIAO-FENG;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD 发明人 LI JI-CHAO;DENG BO;CAO XIAO-FENG
分类号 G06F1/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址